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Thermal Pad/Film Low-k Series

Thermal <strong>Pad</strong>/Film Low-k Series
产品介绍 Low-K导热垫系列具有低介电特性, 减少了使用过程中信号传输的响应时间, 从而保证信号接收和传输的顺利进行。 产品特点• 低介电常数 • 柔软且可压缩 • 适用于通信应用 典型应用 通讯设备 • 网络信息设备 • 交互式接收装置 • 航空电子设备 • ...

Thermal Pad Silicone Free Series

Thermal <strong>Pad</strong> Silicone Free Series
PRODUCT INTRODUCTION Silicone oil-free thermal pad is a thermal interface material without small molecular siloxane. It fundamentally eliminates the volatilization of silicone oil and will not ...

High Rebound Thermal Pad

High Rebound Thermal <strong>Pad</strong>
PRODUCT INTRODUCTION High rebound thermal pad is a silicone-based thermal interface material with high thermal conductivity and low compression set. Low interface thermal resistance can be achieved ...

Thermal Pad Ultra Soft Series

Thermal <strong>Pad</strong> Ultra Soft Series
Ultra soft thermal pad has the characteristics of ultra-low hardness and high compressibility. Compared with common thermal pad, it has ultra-low installation stress which can avoid the damage of ...
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