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Products > thermal conductivity > Shenzhen Hsr Technology Co., Ltd. | Similar Products
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" in Insulation Materials & Elements found 10 Products from Shenzhen Hsr Technology Co., Ltd., China
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(1-10 out of 10)

Laird Tgard K52 Thermally Conductive Insulators

Laird Tgard K52 Thermally Conductive Insulators
Laird Tgard K52 Thermally Conductive Insulators HIGH THERMAL AND DIELECTRIC PERFORMANCE INSULATOR PAD Laird Tgard K52 is a high thermal and dielectric performance insulator pad consisting of ...

Laird Tgard 200B

Laird Tgard 200B
FEATURES & BENEFITS1. High thermal conductivity of 5.0 W/m·K 2.High dielectric breakdown voltage 6,000 volts 3.Resistant to tears and punctures4.UL94 V0 rated Laird Tgard 200B series present ...

Bergquist Liqui Form Tlf 10000

Bergquist Liqui Form Tlf 10000
Features and benefits Thermal conductivity: 10 W/m-K Dispensable pre-cured gel Stable viscosity in storage and in applications Excellent chemical stability and mechanical stability BERGQUIST LIQUI ...

BERGQUIST GP2500S20 Gap Pad 2500S20 GAP PAD TGP 2400

BERGQUIST GP2500S20 Gap Pad 2500S20 GAP PAD TGP 2400
BERGQUIST GP2500S20 is a thermally conductive, reinforced material rated at a thermalconductivity of 2.4 W/m-K.The material is a filled-polymer material yielding extremely soft,elastic ...

Bergquist Gap Pad Tgp 12000ulm

Bergquist Gap Pad Tgp 12000ulm
1.Thermal conductivity: 12 W/m-K (ASTM D5470)2.Exceptional thermal performance at low pressures3.Ultra-low modulus allows for excellent adhesion to rough surfaces4.Supplied with protective liners for ...

Bergquist GPHC3.0 Gap Pad Hc 3.0 Gap Pad Tgp HC3000

Bergquist GPHC3.0 Gap Pad Hc 3.0 Gap Pad Tgp HC3000
BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC3000 BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K.The material offers exceptional ...

Bergquist BP660P Bond-ply Tbp 400p BOND-PLY 660P

Bergquist BP660P Bond-ply Tbp 400p BOND-PLY 660P
BERGQUIST BOND-PLY TBP 400P Formerly known as BOND-PLY 660PThermally Conductive, Film Reinforced, Pressure Sensitive Adhesive TapeBERGQUIST BOND-PLY TBP 400P is a thermally conductive, electrically ...

Laird Tflex 300 Thermal Gap Filler

Laird Tflex 300 Thermal Gap Filler
Laird Tflex 300 Thermal Gap Filler Product Description Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to ...

Bergquist SPA1500 Sil Pad Tsp A2000 SIL PAD A1500

Bergquist SPA1500 Sil Pad Tsp A2000 SIL PAD A1500
Bergquist SPA1500 Sil Pad Tsp A2000 SIL PAD A1500 BERGQUIST SPA1500 Electrically Insulating, Thermally Conductive Elastomeric Material BERGQUIST SPA1500 is a silicone-based, thermally conductive ...

Bergquist SPK4 Sil Pad Tsp K900 SIL PAD K4

Bergquist SPK4 Sil Pad Tsp K900 SIL PAD K4
BERGQUIST SPK4 SIL PAD TSP K900 Formerly known as SIL PAD K4 The Polyimide-Based Insulator BERGQUIST SIL PAD TSP K900 uses a specially developed film which has high thermal conductivity, high ...
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