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Products > thermal solution > Shenzhen Hsr Technology Co., Ltd. | Similar Products
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thermal solution

" in Insulation Materials & Elements found 2 Products from Shenzhen Hsr Technology Co., Ltd., China
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Bergquist Gap Pad Tgp 12000ulm

Bergquist Gap Pad Tgp 12000ulm
1,000Hz 8.4 Dielectric Breakdown Voltage: 0.04 inch sample, VAC 6,200 Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 12Material solutions for cloud recommends BERGQUIST GAP PAD TGP ...

Laird Tflex 300 Thermal Gap Filler

Laird Tflex 300 Thermal Gap Filler
lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Tflex 300TG is offered with a cut-through resistant Tgard silicone liner. ...
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