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Products > application modules > Shenzhen Hsr Technology Co., Ltd. | Similar Products
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application modules

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Bergquist GPHC3.0 Gap Pad Hc 3.0 Gap Pad Tgp HC3000

Bergquist GPHC3.0 Gap Pad Hc 3.0 Gap Pad Tgp HC3000
at low pressures due to a unique 3.0 W/m-K filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiringlow stress on components and boards during ...

Sil Pad Tsp 1800 Sil Pad 1200 Bergquist SP1200

Sil Pad Tsp 1800 Sil Pad 1200 Bergquist SP1200
BERGQUIST SP1200 is a silicone based,fiberglass-reinforced thermal interface material featuringa smooth,highly compliant surface.The mate-rial features a non-tacky surface for efficientre-positioning ...
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