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Aluminum Nitride Insulating Ceramic Cheet

Aluminum Nitride Insulating Ceramic Cheet
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Aluminum Nitride Ceramic Substrate

Aluminum Nitride Ceramic Substrate
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Polished Aluminum Nitride Ceramic Disk

Polished Aluminum Nitride Ceramic Disk
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Aln Aluminum Nitride Ceramic Thermal Pads AlN Substrate

Aln Aluminum Nitride Ceramic Thermal Pads AlN Substrate
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Drill Hole AlN Insulating Ceramic

Drill Hole AlN Insulating Ceramic
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

AlN Ceramic Plate or Wafer

AlN Ceramic Plate or Wafer
Application: 1. HBLED 2. optical-communication 3. High-power RF Devices 4. Power Electronic Devices 5. Power Module 6. Special Cooling Device Different shapes and dimensions are available via laser ...

High Thermal Conductivity AlN Ceramic Insulator

High Thermal Conductivity AlN Ceramic Insulator
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Aluminum Nitride Ceramic Substrate

Aluminum Nitride Ceramic Substrate
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Laser Scribing Aluminum Nitride Ceramic Shim

Laser Scribing Aluminum Nitride Ceramic Shim
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Laser Scribing AlN Ceramic Substrate

Laser Scribing AlN Ceramic Substrate
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...

Dielectric AlN Ceramic Substrate Heat Sink

Dielectric AlN Ceramic Substrate Heat Sink
m 0.3-0.5 Camber (length‰) ≤3‰ Thermal Properties Thermal conductivity (30ºC) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties ...
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