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LCP FCCL(Single Side/Double Side)--2L FCCL: LCP FCCL(Single Side/Double Side)--2L FCCL 5G uses higher frequency signals, which requires higher dielectric constant and dielectric loss of materials. LCP, as the best FPC substrate to replace Pl, ...

Ultra-Thin Peelable Copper Foil,Heat-Resistant Peelable Copper Foil: Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC ...

EMI Shielding Film(Electromagnetic Interference Shielding Film): EMI Shielding Film Electromagnetic Interference Shielding FilmESF-TD1600,ESF-TD2300 EMI Shielding Film is mainly used in FPC which consist of Modules for mobile phones,PC,medical devices,digital ...

Conductive Adhesive Film: Conductive Adhesive Film CAF-TD200,CAF-TD300 Product Characteristics: 1.Low moisture absorption 2.High reliability and conductivity 3.Excellent heat resistance 4.Long shelf-life 5.Good peel strength ...

Ultra-Thin Copper Clad Laminates: Ultrathin FCCLUltrathin FCCL TD-FNC has high peeling strength, outstanding soldering reliability, dimensional stability, mechanical and electrical properties. The copper is highly uniform with tight ...

2 Layer FCCL,Adhesiveless Double Single Copper Clad Laminate,2-layer Flexible Circuit Boards: Adhesiveless Single-Sided Copper Clad Laminate-- 2 Layer FCCL Adhesiveless Double-Sided Copper Clad Laminate-- 2 Layer FCCL FCCL-TD-W, FCCL-TD-A (Double) Product Characteristics: 1.Excellent heat ...

Super Heat-resistant Polyimide Film,3 Layer FCCL,FCCL Adhesive Double Single Copper Clad Laminate: Polyimide Film Based Fccl (Single-side FCCL,Double-side FCCL)Epoxy resin PI film based FCCL is composed of three kinds of materials, copper foil, adhesive and PI film,which are compounded by high ...

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LCP FCCL(Single Side/Double Side)--2L FCCL