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Box Build Assembly: die-casting, complex CNC forming and aluminum extrusion. Our manufacturing partners and supply chain resources uphold our strict quality standards and allow us to provide complete sheet metal ...

BGA PCB Assembly: A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can ...

Plastic Injection Molding: Which Mold do you want to do? Plastic Injection/die casting or punch mold, etc. Which Mould Material do you want choice? 45#, 50#, P20, H13, 718, 2738, NAK80, S136, SKD61, etc. Which does the Product ...

Box Build Assembly: die-casting, complex CNC forming and aluminum extrusion. Our manufacturing partners and supply chain resources uphold our strict quality standards and allow us to provide complete sheet metal ...

BGA PCB Assembly: A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can ...

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Box Build Assembly