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BGA PCB Assembly

BGA PCB Assembly
overheating problems. Lower inductance: Because each solder ball in a BGA China circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly ...

BGA PCB Assembly

BGA PCB Assembly
overheating problems. Lower inductance: Because each solder ball in a BGA China circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly ...
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