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Products > interface > Seantec | Similar Products

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Tflex 600 Series Thermal Gap Filler: Tflex™ 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride ...

Tflex UT20000 Series Ultra-Thin Thermal GapFiller: Tflex™ UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed ...

TFLEX700 Series Thermal Gap Filler: Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or ...

Tputty 607 Gap Filler: from automation and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty™ 607 will exert minimal ...

IceKap P30000: IceKap™ P30000 is a silicone-free, high-performance thermal interface material designed for use in TIM 1.5 and TIM 2 applications. In certain instances, IceKap ™ P30000 can be used in TIM 1 ...

Tflex 700 Series Thermal Gap Filler: Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or ...

Tputty 508 Dispensable Gap Filler: fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations. Tputty™ 508 is ideal for applications that can benefit from ...

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