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Bopi Polyimide Film Used for FPC, Label, Electrical Insulation & Heat Resistance

Bopi Polyimide Film <strong>Used</strong> for FPC, Label, Electrical Insulation & Heat Resistance
Standard of Performance Thickness 25um Tensile strength(TD) ≥170Mpa Tensile strength(MD)≥165Mpa Elongation≥40 % Young's Modulus≥3.1Gpa Dielectric Constant 3.5±0.4 Dissipation Factor≤0.004 Volume ...

Widely Used Polyimide Pi Film with High Temperature Resistant

Widely <strong>Used</strong> Polyimide Pi Film with High Temperature Resistant
Standard of Performance Thickness 25um Tensile strength(TD) ≥170Mpa Tensile strength(MD)≥165Mpa Elongation≥40 % Young's Modulus≥3.1Gpa Dielectric Constant 3.5±0.4 Dissipation Factor≤0.004 Volume ...
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