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Products > cutting device > Homray Material Technology Co.,Ltd | Similar Products
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2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping

2 Inch As-<strong>cut</strong> SiC Wafers Manufacturer for Grinding Wheel No Lapping
cut SiC wafer for grinding wheel , abrasives, newest polishing technololy testing etc. The diameter of 2 inch raw cut SiC wafer is 50.8mm, dopant is N Nitrogen. We have differenct thickness for ...

As Cut SiC Wafer Manufactuer for Polishing Testing

As <strong>Cut</strong> SiC Wafer Manufactuer for Polishing Testing
cut SIC wafer with favourable quotation on the market. Our As-cut SiC wafer MPD＜1cm-2 and thickness about 400um and 600um. Purchasing unpolished SiC wafer for grinding and polishing equipment ...
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