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Raw Cut SiC Slicing Wafer 1150um Manufacturer Without Lapping and Polishing: Raw Cut SiC Slicing Wafer 1150um Manufacturer Without Lapping and Polishing Our As-cut SiC Wafer has a diameter of 150mm, making it perfect for a range of applications. The surface of our As-cut SiC ...

1100um Raw Cut 6 Inch SiC Wafer Manufacturer for Grinding Wheel: 1100um Raw Cut 6 Inch SiC Wafer Manufacturer for Grinding Wheel HMT focus on producing SiC boules and As-cut SiC wafers. we have different thickness of unpolished SiC wafer, like 500um 600um 800um ...

SiC Wafer Manufacturer Best Price 6 Inch SiC Wafer: Purchasing low cost 6 inch SiC Wafer from HMT SiC Substrate Wafer Manufacturer in China. We offer D grade R grade and P grade 6 inch SiC Substrate for 4H polytype Conductive type. Our 6 inch SiC ...

2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping: 2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping HMT provide no lapping 2 inch As cut SiC wafer for grinding wheel , abrasives, newest polishing technololy testing etc. The ...

As Cut SiC Wafer Manufactuer for Polishing Testing: As Cut SiC Wafer Manufactuer for Polishing Testing We manufacture both 4 inch and 6 inch As-cut SIC wafer with favourable quotation on the market. Our As-cut SiC wafer MPD＜1cm-2 and thickness about ...

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