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Products > technology & communication > Homray Material Technology Co.,Ltd | Similar Products
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2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping

2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping
We have differenct thickness for customers choice. 1200um 1100um 900um 600um etc. We offer best price of unpolished SiCWafer on ther market including 2 inch 4 inch 6 inch and 8inch. SiC substrate is ...

As Cut SiC Wafer Manufactuer for Polishing Testing

As Cut SiC Wafer Manufactuer for Polishing Testing
technology and process level, large-scale application of GaN material as substrate is still facing challenges. Its application mainly uses sapphire, silicon wafer or semi-insulating SiC wafer as ...
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