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2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping

2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping
testing etc. The diameter of 2 inch raw cut SiC wafer is 50.8mm, dopant is N Nitrogen. We have differenct thickness for customers choice. 1200um 1100um 900um 600um etc. We offer best price of ...

As Cut SiC Wafer Manufactuer for Polishing Testing

As Cut SiC Wafer Manufactuer for Polishing Testing
testing. SiC substrate is the cornerstone of GaN and SiC application in the third generation semiconductor materials. Due to the limitation of technology and process level, large-scale application ...
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