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2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping

2 Inch As-cut SiC Wafers Manufacturer for Grinding Wheel No Lapping
testing etc. The diameter of 2 inch raw cut SiC wafer is 50.8mm, dopant is N Nitrogen. We have differenct thickness for customers choice. 1200um 1100um 900um 600um etc. We offer best price of ...

Conductive N Type SiC Boule Manufacturer for Cold Split Testing

Conductive N Type SiC Boule Manufacturer for Cold Split <strong>Test</strong>ing
SiC Boule Manufacturers HMT supply 6 inch D grade SiC Boule For wafer polishing Machine Testing. we supply both 4 inch and 6 inch D grade R grade and P grade SiC Boule with competitive price at the ...
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