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Products > precision hole processing > Yangzhou Jingge Semiconductor Technology Co., Ltd. | Similar Products
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precision hole processing

" found 5 Products from Yangzhou Jingge Semiconductor Technology Co., Ltd., China
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(1-5 out of 5)

OEM Single-crystal Silicon Parts,Silicon Prism,Silicon Scanning Galvanometer Target,Silicon Lens

OEM Single-crystal Silicon Parts,Silicon Prism,Silicon Scanning Galvanometer Target,Silicon Lens
processing, including double-sided polishing, double-sided etching, and double-sided lapping. 3.We can manufacture wafers in thicknesses from 100 µm (4 inches) to 2000 µm. Silicon wafers for sensors ...

OEM Single-crystal Silicon Parts,Semiconductor Silicon Rings,Silicon Targets, Silicon Slotted Rings

OEM Single-crystal Silicon Parts,Semiconductor Silicon Rings,Silicon Targets, Silicon Slotted Rings
processing, including double-sided polishing, double-sided etching, and double-sided lapping. 3.We can manufacture wafers in thicknesses from 100 µm (4 inches) to 2000 µm. Silicon wafers for sensors ...

OEM Single-crystal Silicon Parts,High-purity Mono Silicon Rods and Multi-Crystalline Silicon Ingot

OEM Single-crystal Silicon Parts,High-purity Mono Silicon Rods and Multi-Crystalline Silicon Ingot
processing, including double-sided polishing, double-sided etching, and double-sided lapping. 3.We can manufacture wafers in thicknesses from 100 µm (4 inches) to 2000 µm. Silicon wafers for sensors ...

OEM Single-crystal Silicon Parts,Monocrystalline Silicon Furnace Tube Pipe,Silicon Tube,Silicon Rods

OEM Single-crystal Silicon Parts,Monocrystalline Silicon Furnace Tube Pipe,Silicon Tube,Silicon Rods
processing, including double-sided polishing, double-sided etching, and double-sided lapping. 3.We can manufacture wafers in thicknesses from 100 µm (4 inches) to 2000 µm. Silicon wafers for sensors ...

OEM Single-crystal Silicon Parts,Silicon Seed Crystal Puller Rod,Silicon Rod,Silicon Sheets Targets

OEM Single-crystal Silicon Parts,Silicon Seed Crystal Puller Rod,Silicon Rod,Silicon Sheets Targets
processing, including double-sided polishing, double-sided etching, and double-sided lapping. 3.We can manufacture wafers in thicknesses from 100 µm (4 inches) to 2000 µm. Silicon wafers for sensors ...
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