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Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components: structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and can be thinned, and can be used in ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material: Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials: rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal ...

Aluminum Metal Matrix Composites for Lighter Weight Designs: based composite material (Sic/Al) (15% SiC-70% SiC) Benefits Light weight High stiffness Low thermal expansion High thermal conductivity Applications High-Power Electronic Devices Thermal ...

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Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components