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Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC: thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC: thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Metal Matrix Composites ,Precision Component Materials,Semiconductor Materials,Al/SiC: Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSi Alloy,Al-Si Alloy, Al/Si Alloy IGBT Packing Material Electronic Packing Material: Expansion（10-6/K） 6.0-17.5 Thermal Conductivity（W/m·K） 100-170 Features -Lightweight : Lighter than aluminum -High rigidity : 1.7times of Aluminum -Low thermal expansion : Almost equal to cast ...

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Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC