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Products > phone . > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products
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(1-19 out of 19)

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Precision Structural Components,Silicon Carbide Structural Parts,Wear Resistance Parts,AlSiC,Al-SiC

Precision Structural Components,Silicon Carbide Structural Parts,Wear Resistance Parts,AlSiC,Al-SiC
. High Wear Resistance: Ideal for components in high-friction environments. Thermal Stability: Performs well under high temperatures. Excellent Thermal Conductivity: Efficiently dissipates heat. Low ...

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material
component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable energy -Smart grid -Traffic control -Power ...

AlSi Alloy ,Al/Si Alloy,Silicon Aluminum Alloy IGBT Packing Material Electronic Packing Material

AlSi Alloy ,Al/Si Alloy,Silicon Aluminum Alloy IGBT Packing Material Electronic Packing Material
Thermal Expansion（10-6/K） 6.0-17.5 Thermal Conductivity（W/m·K） 100-170 Features -Lightweight : Lighter than aluminum -High rigidity : 1.7times of Aluminum -Low thermal expansion : Almost equal to ...

AlSiC,Al/SiC,Al-SiC,Metal Matrix Composite,Aluminum Ceramic Material,Aluminum Alloy

AlSiC,Al/SiC,Al-SiC,Metal Matrix Composite,Aluminum Ceramic Material,Aluminum Alloy
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Matrix Composite,Thermal Conductive Material,Aluminum Alloy,Aluminum Ceramic,Al-SiC,AlSiC

Aluminum Matrix Composite,Thermal Conductive Material,Aluminum Alloy,Aluminum Ceramic,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC
component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Smart grid -Traffic control -Power conversion -Industrial ...

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC
Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Metal Matrix Composites ,Precision Component Materials,Semiconductor Materials,Al/SiC

Aluminum Metal Matrix Composites ,Precision Component Materials,Semiconductor Materials,Al/SiC
Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSi Alloy,Al-Si Alloy, Al/Si Alloy IGBT Packing Material Electronic Packing Material

AlSi Alloy,Al-Si Alloy, Al/Si Alloy IGBT Packing Material Electronic Packing Material
Expansion（10-6/K） 6.0-17.5 Thermal Conductivity（W/m·K） 100-170 Features -Lightweight : Lighter than aluminum -High rigidity : 1.7times of Aluminum -Low thermal expansion : Almost equal to cast ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
. High Wear Resistance: Ideal for components in high-friction environments. Thermal Stability: Performs well under high temperatures. Excellent Thermal Conductivity: Efficiently dissipates heat. Low ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
. High Wear Resistance: Ideal for components in high-friction environments. Thermal Stability: Performs well under high temperatures. Excellent Thermal Conductivity: Efficiently dissipates heat. Low ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC
of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and can be thinned, and can be used in electronic component thermal management, automotive ...
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