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JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

Automatic Wafer Cleaning Device After Light Resistance: Automatic Wafer Cleaning Device After Light Resistance Product Description Application field: removal of photoresistance/wafer cleaning after grinding Wafer size: 150mm&200mm&300mm ...

CJM Ultra Precision Scrubbing Machine: Name TSP CJM2/4-75 S/Z CJM2/4-85 S/Z Appearance Size L1876mm*W1640mm*H1600士25mm L2437mm*W1705mm*H1600士25mm L1876mm*W1705mm*H1600士25mm L2437mm*W1640mm*H1600士25mm Max CJM214-75S/Z: ...

HM Pumex Grinding Machine: equipped to ensure timely braking in various control programs to ensure forward and reverse response time; 4. Reasonably design the grinding brush water supply tank and grinding brush to ensure the ...

SMT Reflow Ovens with Square Tower-TF2-F: Surface Mount Reflow Ovens are essential tools in modern electronics manufacturing, ensuring high precision and efficiency in soldering processes. These ovens are engineered to provide uniform heat ...

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JT Copper Reduction Line