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JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

CJM Ultra Precision Scrubbing Machine: Automatic tracking of a certain board position, automatic control, stable grinding pressure: 6. Quick brush changing design, reducing labor intensity, improving efficiency, with a brush changing time ...

HM Pumex Grinding Machine: making the grinding program have three functions: thin, medium, and thick. The thickness range can reach 0.2MM~3.2MM, and a model capable of producing 10MM thick has been developed according to ...

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JT Copper Reduction Line