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JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

CJM Ultra Precision Scrubbing Machine: Automatic tracking of a certain board position, automatic control, stable grinding pressure: 6. Quick brush changing design, reducing labor intensity, improving efficiency, with a brush changing time ...

SMT Reflow Ovens with Square Tower-TF2-F: Applicable Process Resin Plug Hole Grinding, Deburring, Removing Copper Particles,Dry Film Pre-treatment, Solder Mask Pre-treatment, ENIG Pre-treatment, HASL Pre-treatment and other positions that ...

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JT Copper Reduction Line