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Products > pcb processing > Shenzhen JuYongNeng Technology Co., Ltd | Similar Products

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JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

Automatic Wafer Cleaning Device After Light Resistance: Automatic Wafer Cleaning Device After Light Resistance Product Description Application field: removal of photoresistance/wafer cleaning after grinding Wafer size: 150mm&200mm&300mm ...

CJM Ultra Precision Scrubbing Machine: Name TSP CJM2/4-75 S/Z CJM2/4-85 S/Z Appearance Size L1876mm*W1640mm*H1600士25mm L2437mm*W1705mm*H1600士25mm L1876mm*W1705mm*H1600士25mm L2437mm*W1640mm*H1600士25mm Max CJM214-75S/Z: ...

HM Pumex Grinding Machine: Name TSP HM3/6-75 S/Z HM3/6-85 S/Z Appearance Size L2247mm*W1600mm*H1400士25mm L2887mm*W1600mm*H1400士25m L2247mm*W1700mm*H1400士25mm L2887mm*W1700mm*H1400土25mm Max HM3/6-75S/Z:660mm*660mm HM3/6-85 ...

SMT Reflow Ovens with Square Tower-TF2-F: Process Resin Plug Hole Grinding, Deburring, Removing Copper Particles,Dry Film Pre-treatment, Solder Mask Pre-treatment, ENIG Pre-treatment, HASL Pre-treatment and other positions that need to be ...

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JT Copper Reduction Line