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Products > pressurization > Shenzhen JuYongNeng Technology Co., Ltd | Similar Products

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JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

CJM Ultra Precision Scrubbing Machine: pressure regulation and automatic detection of plate thickness function; 4. Automatic abrasion test and automatic brushing function: 5. Automatic tracking of a certain board position, automatic ...

HM Pumex Grinding Machine: design the grinding brush water supply tank and grinding brush to ensure the supply of ash and play a bridging role under the grinding brush, ensuring the ability of 0.2MM plate thickness to pass ...

SMT Reflow Ovens with Square Tower-TF2-F: Surface Mount Reflow Ovens are essential tools in modern electronics manufacturing, ensuring high precision and efficiency in soldering processes. These ovens are engineered to provide uniform heat ...

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JT Copper Reduction Line