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Products > sintering process > Hunan Mana Materials Technology Co.,Ltd | Similar Products

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sintering process

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Ruthenium Paste for Thick Film Circuits: Cycle（△R%）-55℃-125℃、5times） ±0.2 ±0.2 ±0.2 ±0.2 ±0.2 ±0.2 ±0.2 Recommended Using Process: 1. Stirring: Gently stir well before use. 2. Recommended Printing Thickness: 20±2µm 3. Mesh Material And ...

Silver Platinum Paste for Thick Film Hybrid Integrated Circuit: sintering, high conductivity, extremely resistant to 96% alumina ceramic substrates good adhesion. 2. Physical Properties Grade MANA-AgPt-6110 Solid Content 78-82 Particle Size(um) ≤10 Viscosity(Pa ...

Silver Palladium Conductor Paste for Thick-film Circuits: Process: 1. Stirring: Gently stir well before use 2. Recommended Printing Thickness: 10-15µm 3. Mesh Material And Mesh: nylon mesh inch 250-300 mesh Stainless Steel Wire Mesh: Inch 260-325 Mesh 4. ...

Low Temperature Sintered Conductive Silver Paste: Mana -Ag-9801C silver paste is a low temperature semi sintering system. It has excellent damp heat resistance and chemical stability. It has low temperature sintering function, fast drying rate, good ...

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Ruthenium Paste for Thick Film Circuits