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Dual in-line Package: Basic Information Name: Dual In-line Package /Dual-Inline Package / Dual Inline Package Abbreviation: DIP Features: Dual entry package Detailed Introiduction The DIP-packaged CPU chip has two rows of ...

Metal Oxide Semiconductor: Basic Information Name: Metal Oxide Semiconductor Abbreviation: MOS Model: Voltage/Current Package Metal Oxide Varistor Specifications / Definition Field Effect Transistor (FET), which converts ...

Quad Flat No-leads Package: Basic Information Name: Quad Flat No-leads Package / Quad Flat No Leads Package Abbreviation: QFN Nature: One of the surface mount packages Introduction QFN (Quad Flat No-leads Package, Quad Flat ...

Quad Flat Package: Basic Information Name: Quad Flat Package Abbreviation: QFP Application: CPU chip pin Here is a table comparing different types of Plastic Quad Flat Packages (PQFPs) and their key differences: PQFP ...

Small Out-Line Package: Small Out-Line Package SOP packaging is a form of component packaging. Common packaging materials include: plastic, ceramics, glass, metal, etc., basically using plastic packaging. It has a wide ...

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Dual in-line Package