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Dual in-line Package: Dual In-line Package DIP package is the abbreviation of dual inline-pin package, also known as dual inline package technology,dual-inline package, a component package form of DRAM. Refers to ...

Metal Oxide Semiconductor: electrons from the bottom layers of the silicon to the surface, and it simultaneously repels holes from the surface. This electric field is too weak, so the change of the carrier concentration is ...

Quad Flat No-leads Package: Quad Flat No-leads Package QFN (Quad Flat No-leads Package,Quad Flat No Leads Package), one of the surface mount packages. It is worth noting that the QFN package is completely different from the LCC ...

Quad Flat Package: Quad Flat Package The Plastic Quad Flat Package offers excellent thermal performance and is designed to meet the demands of high-density electronic devices. The Plastic Quad Flat Package features a ...

Small Out-Line Package: Small Out-Line Package SOP packaging is a form of component packaging. Common packaging materials include: plastic, ceramics, glass, metal, etc., basically using plastic packaging. It has a wide ...

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Dual in-line Package