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Dual in-line Package

Dual in-line Package
Dual In-line Package DIP package is the abbreviation of dual inline-pin package, also known as dual inline package technology,dual-inline package, a component package form of DRAM. Refers to ...

Quad Flat No-leads Package

Quad Flat No-leads Package
Quad Flat No-leads Package QFN (Quad Flat No-leads Package,Quad Flat No Leads Package), one of the surface mount packages. It is worth noting that the QFN package is completely different from the LCC ...

Small Out-Line Package

Small Out-Line Package
Small Out-Line Package SOP packaging is a form of component packaging. Common packaging materials include: plastic, ceramics, glass, metal, etc., basically using plastic packaging. It has a wide ...
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