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Dual in-line Package: Dual In-line Package DIP package is the abbreviation of dual inline-pin package, also known as dual inline package technology,dual-inline package, a component package form of DRAM. Refers to ...

Quad Flat No-leads Package: stress occurs between the printed substrate and the package, it cannot be relieved at the electrode contact. Therefore, it is difficult to have as many electrode contacts as there are QFP pins, ...

Small Out-Line Package: Small Out-Line Package SOP packaging is a form of component packaging. Common packaging materials include: plastic, ceramics, glass, metal, etc., basically using plastic packaging. It has a wide ...

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Dual in-line Package