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Dual in-line Package: Dual In-line Package DIP package is the abbreviation of dual inline-pin package, also known as dual inline package technology,dual-inline package, a component package form of DRAM. Refers to ...

Quad Flat No-leads Package: Quad Flat No-leads Package QFN (Quad Flat No-leads Package,Quad Flat No Leads Package), one of the surface mount packages. It is worth noting that the QFN package is completely different from the LCC ...

Quad Flat Package: Quad Flat Package The Plastic Quad Flat Package offers excellent thermal performance and is designed to meet the demands of high-density electronic devices. The Plastic Quad Flat Package features a ...

Small Out-Line Package: Small Out-Line Package SOP packaging is a form of component packaging. Common packaging materials include: plastic, ceramics, glass, metal, etc., basically using plastic packaging. It has a wide ...

Metal Oxide Semiconductor: Package Metal Oxide Varistor Specifications / Definition Field Effect Transistor (FET), which converts changes in input voltage into changes in output current. The gain of a FET is equal to its ...

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Dual in-line Package