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PTM-120T Chip Module Initialization and Testing Machine

PTM-120T Chip Module Initialization and Testing Machine
chip initialization & pre-personalization as well as reject chip punching and marking.The brand-new design enables operators to switch chips production between 6PIN and 8PIN within 60 seconds. ...

M2M Semiconductor Chip Personalization Machine

M2M Semiconductor Chip Personalization Machine
Machine-to-Machine (M2M) semiconductor chip making equipment are specialized devices used in the production and personalization of M2M chips. These chips are used in various applications, including ...

DCP500 M2M Chip Programming Machine

DCP500 M2M Chip Programming Machine
The DCP500 ic chip making machine can perform electrical performance testing and personalized data writing on small batches of M2M chips, automotive electronic SE (Security Element - security chips), ...

Piotec Smart Card Making Machine

Piotec Smart Card Making Machine
chips. This process is known as dicing. Packaging: The individual chips are then packaged to protect them from physical damage and environmental factors. This involves placing the chip in a ...

Smart Card Personalization and Issuing Machine

Smart Card Personalization and Issuing Machine
tests, chip initialization & pre-personalization as well as reject chip punching and marking. The brand-new design enables operators to switch chip production between 6PIN and 8PIN within 60 seconds. ...

SCM3000 M2M Chip Personalization Machine

SCM3000 M2M Chip Personalization Machine
The M2M Chip Personalization Machine SCM3000 can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, ...

SCM200 M2M Chip Personalization Machine

SCM200 M2M Chip Personalization Machine
The SCM200 M2M chip personalization data writing machine can perform electrical performance testing, personalized data writing, and surface laser personalized printing on M2M chips, automotive ...

PTCME302 Chip Module Encapsulation Machine

PTCME302 Chip Module Encapsulation Machine
chip gun waste holes that fail thickness testing and adhesive appearance defect testing. 2. Use the chasing gun waste mode, with a diameter of 2 ± 0.1mm and a positional error of ≤ ± ...
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