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Products > material specifications > Shenyang Piotec Technology Co.,LTD | Similar Products

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" found 4 Products from Shenyang Piotec Technology Co.,LTD, China

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Piotec Smart Card Making Machine: specific requirements of the application. This includes determining the memory size, processing power, and security features. Wafer Fabrication: The design is then used to create a silicon wafer, ...

SCM3000 M2M Chip Personalization Machine: material loss and labor costs. Output Module Tray Output: up to 20pcs of trays can be loaded. Tape Output: Compatible with tape rolls in 1000pcs and 3000pcs. Compatible with tray and tape output for ...

PTM-120T Chip Module Initialization and Testing Machine: Material Receiving Unit Roll up the written and tested strips and wrap them with protective tape; This unit can work independently. Broken Reinforcement Unit (Optional) Capable of cutting the ...

PTCME302 Chip Module Encapsulation Machine: Specifications of PTCME302-Chip Module Encapsulation Machine PARAMETER Capacity Full fill: 33000UPH; Dam filling: 23000UPH Dimension 7300mm×1200mm×2000mm Weight 2100Kg Power Supply 220V(-5%～+10%), ...

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