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Products > smart testing machine > Shenyang Piotec Technology Co.,LTD | Similar Products

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smart testing machine

" found 9 Products from Shenyang Piotec Technology Co.,LTD, China

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(1-9 out of 9)

M2M Semiconductor Chip Personalization Machine: Machine-to-Machine (M2M) semiconductor chip making equipment are specialized devices used in the production and personalization of M2M chips. These chips are used in various applications, including ...

FPL6052 Banking Card Flexible Perso Line: The Piotec FPL series products are personalized production solutions tailored to the mass production needs of bank card manufacturers. This product is based on the 'flexible personalized production ...

DCP500 M2M Chip Programming Machine: The DCP500 ic chip making machine can perform electrical performance testing and personalized data writing on small batches of M2M chips, automotive electronic SE (Security Element - security chips), ...

Piotec Smart Card Making Machine: smart card. Testing: The packaged chips are then tested to ensure they function correctly. This involves checking their electrical characteristics and verifying that they can correctly execute their ...

Smart Card Personalization and Issuing Machine: smart card personalization machine can be configured with function modules including magnetic encoding, contact IC encoding, contactless IC encoding, thermal printing, embossing and indenting, ...

SCM3000 M2M Chip Personalization Machine: The M2M Chip Personalization Machine SCM3000 can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, ...

SCM200 M2M Chip Personalization Machine: The SCM200 M2M chip personalization data writing machine can perform electrical performance testing, personalized data writing, and surface laser personalized printing on M2M chips, automotive ...

PTM-120T Chip Module Initialization and Testing Machine: testing items Open-short test for pins (positive and negative current is adjustable). Leakage current test supported. Static current test supported. FVMI and FIMV (V=f(I), I=f(V)) supported. Pin ...

PTCME302 Chip Module Encapsulation Machine: testing and adhesive appearance defect testing. 2. Use the chasing gun waste mode, with a diameter of 2 ± 0.1mm and a positional error of ≤ ± 0.2mm. Advantages of PTCME302-Chip Module Encapsulation ...

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