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SCM3000 M2M Chip Personalization Machine: Temperature 23℃±3℃ Working Humidity 50±10% Compressed Air stress: 0.5Mpa Flow rate: 300LPM Communication Interface Ethernet Fuctions of SCM3000 M2M Chip Personalising Machine PARAMETER Input ...

SCM200 M2M Chip Personalization Machine: Temperature 23℃±3℃ Operation Humidity 50±10%rh Compressed Air stress: 0.5Mpa Flow rate: 3300L/M Communication Interface Ethernet Functions of SCM200 M2M Chip Personalization ...

PTM-120T Chip Module Initialization and Testing Machine: Testing Machine PARAMETER Capacity 53000UPH Dimension 4750mm×840mm×1960mm(including broken reinforcement units); 3800mm×840mm×1960mm(excluding broken reinforcement units) Weight 800kg (including ...

PTCME302 Chip Module Encapsulation Machine: Temperature Room temperature: 23℃±3℃ Operation Humidity 50±10％ Functions of PTCME302-Chip Module Encapsulation Machine PARAMETER Issuing/receiving Unit 1. Loadable inner diameter φ 40mm (without ...

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SCM3000 M2M Chip Personalization Machine