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Hubless Resin Diamond Dicing Blade for Semiconductor

Hubless Resin Diamond Dicing Blade for Semiconductor
Ceramics, Optical, QFN, Splitter Metal diamond dicing blade Features: High Rigidity minimized Wavy And Slant Cutting ; Able To Control Diamond Concentration To Achieve Cutting Quality ;Excellent ...

LD66/77 Polyurethane Polishing Pad for Glass

LD66/77 Polyurethane Polishing Pad for Glass
mobile phone glass polishing, LCD glass and other substrate glass etc. LD66 is characterized with good flexible and long durable life, the polishing yield rate can reach to 98%, LD77 has a better ...
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