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SiC Wafer Boat

SiC Wafer Boat
5 ± 0.03 2.60-2.70 Flexural Strength MPa (kpsi) 338(49) 380(55) 80-90 (20°C) 90-100(1400°C) Compressive Strength MPa (kpsi) 1120(158) 3970(560) > 600 Hardness Knoop 2700 2800 / Breaking Tenacity MPa ...

Wafer Boat for Semiconductor Process

Wafer Boat for Semiconductor Process
5 ± 0.03 2.60-2.70 Flexural Strength MPa (kpsi) 338(49) 380(55) 80-90 (20°C) 90-100(1400°C) Compressive Strength MPa (kpsi) 1120(158) 3970(560) > 600 Hardness Knoop 2700 2800 / Breaking Tenacity MPa ...
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