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SiC Wafer Boat

SiC Wafer Boat
600 Hardness Knoop 2700 2800 / Breaking Tenacity MPa m1/2 4.5 4 / Thermal Conductivity W/m.k 95 120 23 Coefficient of Thermal Expansion 10-6.1/°C 5 4 4.7 Specific Heat Joule/g 0k 0.8 0.67 / Max ...

Wafer Boat for Semiconductor Process

Wafer Boat for Semiconductor Process
(20°C) 90-100(1400°C) Compressive Strength MPa (kpsi) 1120(158) 3970(560) > 600 Hardness Knoop 2700 2800 / Breaking Tenacity MPa m1/2 4.5 4 / Thermal Conductivity W/m.k 95 120 23 Coefficient of ...
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