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Products > assembler > Standard Systems | Similar Products

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Semiconductor Assembly & Packaging Services: Standard Systems provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN,PLCC, SOIC, PDIP, Etc...... Willing to work for Fabless and IC Design ...

Semiconductor Assembly & Packaging Services: Standard Systems company Provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN...... Willing to work for Fabless and IC Design companies can ...

IC Assembly Services for Fabless Companies: Standard Systems, Working at IC Assembly Service company have been providing Semiconductor Assembly Services to IC Design and Fabless companies, and also supplying components to world wide ...

IC Packaging(IC Assembly,Dummy Components Build): Standard Systems have been providing Semiconductor Assembly Services to IC design companies or Fabless companies since 1996. We use good sub- contractors in Korea and other Asia area for IC assembly ...

LQFP; Low Profile Quad Flat Package: LQFP /Low Profile Quad Flat Pack Note : Power Quad 2 & 4 LQFP, ExposedPad LQFP are also available. LQFP : Body Size : Smallest 7mmx7mm, Largest : 28mmx28mm Body Thickness :1.4mm Lead Form : 1.0mm ...

TSOP(I). Thin Small Outline: Click to enlarge image ( Dummy Component;Mechanical IC ) TSOP(I) / Thin Small Outline (Type I) TSOP(I) : Body Size : Smallest 8x11.8mm, Largest : 12mmx18.4mm Body Thickness :1.0mm Lead Count : ...

PLCC. Plastic Leaded Chip Carrier: Click to enlarge image ( Dummy Component;Mechanical IC ) PLCC / Plastic Leaded Chip Carrier Body Size : Smallest .352” x.352” , Largest : 1.152” x1.152” Body Thickness : ...

PDIP, SPDIP. Dual-In-Line Packages: PDIP , SPDIP /(Shrink) Plastic Dual In Line PDIP : 300MIL/ 8LD ~28LD ,400MIL /22LD,600MIL /24LD~48LD SPDIP : 400MIL/ 30LD~32LD,600MIL/ 42LD ~56LD,750MIL/ ...

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