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IC Packaging(IC Assembly,Dummy Components Build)

IC Packaging(IC Assembly,Dummy Components Build)
Standard Systems have been providing Semiconductor Assembly Services to IC design companies or Fabless companies since 1996. We use good sub- contractors in Korea and other Asia area for IC assembly ...

TSOP(I). Thin Small Outline

TSOP(I). Thin Small Outline
Click to enlarge image ( Dummy Component;Mechanical IC ) TSOP(I) / Thin Small Outline (Type I) TSOP(I) : Body Size : Smallest 8x11.8mm, Largest : 12mmx18.4mm Body Thickness :1.0mm Lead Count : ...

PLCC. Plastic Leaded Chip Carrier

PLCC. Plastic Leaded Chip Carrier
Click to enlarge image ( Dummy Component;Mechanical IC ) PLCC / Plastic Leaded Chip Carrier Body Size : Smallest .352” x.352” , Largest : 1.152” x1.152” Body Thickness : ...

PDIP, SPDIP. Dual-In-Line Packages

PDIP, SPDIP. Dual-In-Line Packages
PDIP , SPDIP /(Shrink) Plastic Dual In Line PDIP : 300MIL/ 8LD ~28LD ,400MIL /22LD,600MIL /24LD~48LD SPDIP : 400MIL/ 30LD~32LD,600MIL/ 42LD ~56LD,750MIL/ ...
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