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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate: interconnected pores distributed uniformly throughout the base copper material. 　　　　Advantage：　　　　1、Copper foam has great function of conducting heat and electricity, which can be used as the ...

Winfly Double Sidel Copper Foam Clad Laminates Cu PCB Laminate: interconnected pores distributed uniformly throughout the base copper material. 　　　　Advantage：　　　　1、Copper foam has great function of conducting heat and electricity, which can be used as the ...

Winfly Single Copper Foam Clad Laminates for Heat Sink: interconnected pores distributed uniformly throughout the base copper material. 　　　　Advantage：　　　　1、Copper foam has great function of conducting heat and electricity, which can be used as the ...

Winfly Thermal Conductive Materials Copper Sheets Metal Cu Foam: MaterialsCopper Foam Electrode SheetThrough Hole Rate>98%PPI10 - 95Thickness5 - 25mmPorosity> 98% 110 pores per inch (50-130PPI can be customized)Bulk density0.1-0.8g/cm3Chemical ...

Winfly Thermal Conductive Materials Copper Sheets Metal Cu Foam: MaterialsCopper Foam Electrode SheetThrough Hole Rate>98%PPI10 - 95Thickness5 - 25mmPorosity> 98% 110 pores per inch (50-130PPI can be customized)Bulk density0.1-0.8g/cm3Chemical ...

Round Copper Foam Conductive Foamed Cu Metal for Lab Electrode Research: interconnected pores distributed uniformly throughout the base copper material. 3、 Due to the structural characteristics of foamed copper and its basic harmlessness to the human body, foamed copper ...

Ultra Thin Foam Copper Conductive Cu Metal Foam for Lab Electrode Research: interconnected pores distributed uniformly throughout the base copper material. 3、 Due to the structural characteristics of foamed copper and its basic harmlessness to the human body, foamed copper ...

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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate