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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate: PCB production, manufacturers use rigid CCLs with substrate material, like resin epoxy (FR4), metal core (alu or copper), PTFE and Ceramic, to fabricate double- and multi-layer circuit boards. ...

Winfly Double Sidel Copper Foam Clad Laminates Cu PCB Laminate: PCB production, manufacturers use rigid CCLs with substrate material, like resin epoxy (FR4), metal core (alu or copper), PTFE and Ceramic, to fabricate single-, double- and multi-layer circuit ...

Winfly Single Copper Foam Clad Laminates for Heat Sink: PCB production, manufacturers use rigid CCLs with substrate material, like resin epoxy (FR4), metal core (alu or copper), PTFE and Ceramic, to fabricate single-, double- and multi-layer circuit ...

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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate