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Products > structured packing types > About Us Contact Us Shenzhen Winfly New Material Co.,LTD | Similar Products

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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate: type of substrate material of printed circuit boards with a thin layer of copper laminated on either one side or both sides, and we call it as Double-sided CCL or double-sided CCL. In rigid PCB ...

Winfly Double Sidel Copper Foam Clad Laminates Cu PCB Laminate: type of substrate material of printed circuit boards with a thin layer of copper laminated on either one side or both sides, and we call it as single-sided CCL or double-sided CCL. In rigid PCB ...

Winfly Single Copper Foam Clad Laminates for Heat Sink: type of substrate material of printed circuit boards with a thin layer of copper laminated on either one side or both sides, and we call it as single-sided CCL or double-sided CCL. In rigid PCB ...

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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate