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Universal Reballing Device

Universal Reballing Device
design, make solder ball pour-out more convenience; 6.Reasonable structure design and beautiful looking,patented product--up to 8 patent protection; Shenzhen Bomatek Electronics Co.,Ltd is a ...

BGA Test Socket Customized

BGA Test Socket Customized
Main Features 1. Pogo Pin Solution. 2. Engineering Material. 3. Adopt Torlon As The Insulation Material. 4. Accurate Positioning On Test Pad or Solder Ball. 5. Long Life Span, High Quality and ...
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