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Products > application module > Dongguan Ziitek Electronical Material and Technology Ltd | Similar Products

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application module

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Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer: Applications ● CPU ● display card ● mainboard/mother board ● notebook ● power supply ● Heat pipe thermal solutions ● Memory Modules ● Mass storage devices ● Automotive electronics Typical Properties ...

Thermal Grease: applications requiring material with minimum bond line thickness and high conductivityIdeal for rework and field repair situations Applications lnclude Semiconductor cases and heat sinksPower ...

3w/Mk Thermal Conductivity High Viscosity Thermally Conductive Putty for Bga Package: Application > Heat-sink & frame > LED backlight module,LED lighting > High speed hardware driver > Micro heat pipe ,Vihicel enginee controler > Telecom industry Feature > Thermal conductivity: ...

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Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer