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Products > soft packaging > Dongguan Ziitek Electronical Material and Technology Ltd | Similar Products

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Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer: Packaging Details & Lead time The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' ...

3w/Mk Thermal Conductivity High Viscosity Thermally Conductive Putty for Bga Package: 3w/Mk Thermal Conductivity High Viscosity Thermally Conductive Putty for Bga Package TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior ...

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Thermal Management Materials 3.0W Silicone Thermal Gap Pad for Electric Parts Heat Transfer