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Suppliers > thermal interface > Hothree Technology | Matching Products
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thermal interface

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(1-10 out of 10)

Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0

Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0
BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electricallyconductive SIL PAD rubber. The material is designed for those applications in which ...

Bergquist Hi-flow 565ut

Bergquist Hi-flow 565ut
thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky• Tabulated for ease of assembly BERGQUIST HI-FLOW THF 3000UT is a naturally tacky, thermally conductive phase ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS
BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling PadGAP PAD TGP 1000VOUS, Silicone Thermal Pad For ConverterGAP PAD VO Ultra Soft Interface Pad Heat Transfer MaterialsBERGQUIST GAP PAD ...

Bergquist Gap Filler Tgf 2000 GF2000

Bergquist Gap Filler Tgf 2000 GF2000
thermally conductive, liquid gap-filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cured material properties and good ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
Features and Benefits 1.Thermal impedance: 0.71°C-in2 /W (25 psi) 2.Electrically isolating 3.65°C phase change compound coated on PEN film 4.Tack-free and scratch-resistant BERGQUIST Hi-Flow 625 ...

Bergquist Gap Pad Tgp 7000ulm

Bergquist Gap Pad Tgp 7000ulm
thermal performance at low pressures.BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a high thermal conductivity of 7.0 W/m-K. It is specially formulated for high ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Bergquist Sp1500st Sil-pad 1500st

Bergquist Sp1500st Sil-pad 1500st
BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape) is a fiberglass reinforcedthermal interface material that is naturally tacky on both sides.BERGQUIST SIL-PAD 1500ST(Thermally Conductive ...

Laird Tflex 600 Thermal Gap Filler

Laird Tflex 600 Thermal Gap Filler
FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...
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