There are 1 GAP PAD TGP HC5000 from 1 suppliers on EC21.com
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BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD HC5.0 (Thermal Silicone Pad)is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000 is supplied with protective liners on both sides.
Registration Date | 2021/11/18(Year/Month/Date) |
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Buyer / Seller in EC21 | Seller |
Business Type | Manufacturer |
Year established | 2011 |
Employees total | 51 - 100 |
Annual revenue | More than 100,000,000 |
Company | Hothree Technology |
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Address | Building F3, Jinyucheng Park, LonggShenzhenGuangdong518219China |
Phone | 86 - 159 - 17959826 |
Homepage | http://www.tim-home.com |
Contact | Carrie |