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  • Wave/Reflow Soldering Pallet Materials

    • Place of origin:  

      China

    TFUER-T315 * Solder Pallet Materials T315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of thermoset epoxy resin and glass fiber fabric, which gives it excellent mechanical strength, thermal stability, and chemical resistance. Key Features 1. Thermal Resistance: T315 can withstand high temper

    [Related Keywords : solder pallet materials]

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