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Min. Order:
100 Set
Price:
US$ 300
Place of origin:
China
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's l
[Related Keywords : BGA PCB Assembly]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
1 Set
Price:
US$ 1 ~ 2
Place of origin:
United States
Door wrapping machine and door shrinking machine Description: Door wrapping machines and door shrinking machines are specialized packaging equipment designed to efficiently and securely package doors for protection during transportation and storage. These machines are commonly used in industries such as manufacturing, distribution, and logistics where doors need to be packaged with care to preven
[Related Keywords : Door Wrapping Machine]
Business Type
Manufacturer
Location
Tianjin, China
Employees Total
101 - 500
Annual Revenue
USD 2,000,001 - 5,000,000
Place of origin:
China
Packaging and ShippingMedium Frequency Melting Furnace is shipped with the highest care and safety to ensure that it can reach its destination in perfect condition. It is securely packaged to minimize the risk of damage and is shipped in the following manner: The furnace is placed in a wooden crate or box.The crate or box is then wrapped in protective packaging.The package is then secured with st
[Related Keywords : Medium Frequency Melting]
Business Type
Manufacturer
Location
Shandong, China
Employees Total
101 - 500
Annual Revenue
USD 1,000,001 - 2,000,000
Competitive dual in line package products from various dual in line package manufacturers and dual in line package suppliers are listed above, please select quality and cheap items for you.
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