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Min. Order:
1 Set
Price:
US$ 1 ~ 300
Place of origin:
China
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's l
[Related Keywords : circuit board assembly]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
USD 2,000,001 - 5,000,000
Competitive on grid controller products from various on grid controller manufacturers and on grid controller suppliers are listed above, please select quality and cheap items for you.
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